ENAU PDS is a specially designed palladium system used to activate the copper surface on a PCB board prior to the deposition of electroless nickel plating process MAR ENEU 12.
ENAU PDS is a Sulphuric acid palladium system used to provide activation of copper with excellent adhesion characteristics.
To ensure proper operation of the ENAU PDS system, the solution chemistry must be maintained between 40 – 50 mg/litre of palladium. This is accomplished by measuring and monitoring the palladium concentration via a standard AA Spectroscopy.
The Sulphuric acid should be analyzed using the standard titration methods.
|Palladium||10 ml/litre of ENAU PDS will increase Pd content by 10 mg/l|
|Normality||10 ml/litre of Sulphuric acid s.g. 1.84 will increase the Normality content by 0.36 N|
|Plating rate @ 190°F||0.3 to 0.5 mils/hr|
|Solution life||7 to 8|
|Tanks:||The installation can be made of Polypropylene, Polyethylene or hard PVC.|
|Heaters:||If required glass, porcelain, PTFE or quartz heater may be used.|
|Filtration||The solution should be regularly filtered, preferably continuously through 5 micron or smaller cartridges. (Cartridges must be leached for one hour in 10% Sulphuric acid and then rinsed well before use.)
The recommended filtration rate is 1 - 2 solution turnovers per hour.
|Agitation||No air agitation. Mechanical movement is highly recommended.|