The Atotech Sulfamate Nickel Plating Process produces deposits that are particularly suitable to engineering and functional uses. The bath can be controlled to obtain consistent deposits over a wide range of stress, hardness, tensile strength, and ductility.

Characteristics of the Atotech Sulfamate Nickel Plating Process and its deposits include:

  • Deposit properties (e.g., hardness, tensile strength) can be altered to meet various specs.
  • Excellent deposit ductility with controllable internal stress (compressive or tensile).
  • Good bath tolerance to impurities.
  • Ease of solution purification - continuous filtration through activated carbon and continuous electrolytic purification are possible.
  • Wide current density range allows fast plating rates.
  • Complete analytical control of all bath constituents.
  • Bath chemistry is stabile over long periods of operation.
  • Heavier, more ductile deposits are possible without build-up of trees and nodules.
For Still or Barrel Plating Optimum Range
Electropure 24 Nickel Sulfamate 55 fl.oz./gal (427 ml/l) 38 - 67 fl./gal (294 - 522 ml/l)
NiCl2 . 6H2O 0.8 oz/gal (6 g/l) 0.8 - 4.0 oz/gal (6 - 30 g/l)
Boric Acid 5 oz/gal (37.5 g/l) 4 - 6 oz/gal (30 - 45 g/l)
SN-1 Addition Agent 1.5 oz/gal (11 g/l) 0 - 1.5 oz/gal (0 - 11 g/l)
Anti-Pit No. 12 (cathode agitation) 0.15% by vol. (1.5 ml/l) 0.1 - 0.3% by vol. (1 - 3 ml/l)
Anti-Pit Y-17 (air agitation) 0.15% by vol. (1.5 ml/l) 0.1 - 0.3% by vol. (1 - 3 ml/l)

The solution is prepared in either a storage tank or the plating tank. All loose dirt, grease, etc. should be wiped off the tank and the sides and bottom scrubbed with a detergent in hot water then thoroughly rinsed. The tank linings and all auxiliary equipment should be leached for 12 hours with a 2 to 5% by volume solution of sulfuric acid heated to 140° F (60° C) and then rinsed thoroughly.

  1. Fill tank to slightly less than one-half of its final volume with water and heat to 150° F (66° C).
  2. Add the required amount of boric acid and agitate until it is dissolved.
  3. Next, add and dissolve the required amount of nickel chloride (NiCl2 •6 H2O).
  4. Add the required amount of Electropure 24 Nickel Sulfamate.
  5. Add the required amount of AP-12 or Y-17 wetting agent and bring solution to final volume with water. If the solution was made in a spare tank, filter into the plating tank. Adjust the pH to 3.5 - 4.2 (electrometric) with Nickel Sulfamate pH Controller, if necessary.
  6. Add the SN-1 addition agent, if it is to be used. The SN-1 should be dissolved in warm water and added to the plating tank through the filter that has been previously coated with filter aid and carbon.
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