ENAU IMAU is an immersion gold process designed for the PCB and chip manufactures.
ENAU IMAU is designed for the deposition of a gold layer over a Nickel-Phosphorous substrate as a final finish for further processing.
ENAU IMAU is a gold layer suitable as a corrosion resistance final layer and component bonding finish.
|Gold Concentration:||1.0 to 2.5 g/litre||2.0 g/litre|
|Density||1.01 – 1.03||1.02|
|Operating Temperature:||50°C to 95°C||80°C|
|pH||4.0 – 6.5||6.0|
A new ENAU IMAU solution requires 30% BV of ENAU IMAU MAKE-UP and 2.0 grams/litre Potassium Gold Cyanide and 1 % BV ENAU IMAG PART N. Make up working solutions as follows:
Optimum bath loading is 0.2 to 0.8 ft2/gallon.
Avoid prolonged periods at working temperature without a reasonable load in the solution. Long idle periods at high temperature can cause solution imbalance, while wasting heat and expensive chemicals.
Solution replenishment should be made based on regular analysis for gold.