PCB

MAR IMAU

ENAU IMAU is an immersion gold process designed for the PCB and chip manufactures.

ENAU IMAU is designed for the deposition of a gold layer over a Nickel-Phosphorous substrate as a final finish for further processing.

ENAU IMAU is a gold layer suitable as a corrosion resistance final layer and component bonding finish.

OPERATING CONDITIONS
RANGE OPTIMUM
Gold Concentration: 1.0 to 2.5 g/litre 2.0 g/litre
Density 1.01 – 1.03 1.02
Operating Temperature: 50°C to 95°C 80°C
pH 4.0 – 6.5 6.0
SOLUTION MAKEUP

A new ENAU IMAU solution requires 30% BV of ENAU IMAU MAKE-UP and 2.0 grams/litre Potassium Gold Cyanide and 1 % BV ENAU IMAG PART N. Make up working solutions as follows:

  1. Fill tank to one-half its final volume with distilled or deionized water.
  2. Add ENAU IMAU Make-up.
  3. Add the pre dissolved KAuCN and mix well.
  4. Add ENAU IMAG PART N.
  5. Add water to final volume and mix well.
  6. Adjust pH to 6.0, by carefully adding a 20% by volume Sulphuric acid to lower pH or 25% liquid KOH to increase.
  7. Adjust the solution temperature to 80°C.
  8. Dummy the solution for 10 – 20 minutes using a nickel plated board.
TANK LOADING

Optimum bath loading is 0.2 to 0.8 ft2/gallon.

Avoid prolonged periods at working temperature without a reasonable load in the solution. Long idle periods at high temperature can cause solution imbalance, while wasting heat and expensive chemicals.

REPLENISHMENTS

Solution replenishment should be made based on regular analysis for gold.

  • Gold is Potassium gold cyanide. To increase the gold content by 0.1 g/litre add 0.146 gram of the Potassium gold cyanide.
  • The ENAU IMAU Make-up is consumed by drag and should be replenished at a rate of 200 mls Make-up per 10 ft2 of copper area.
Please note that the information above for this chemical is partial. Click the button below to request full technical information sheet.
Request Technical Information Sheet

PCB

Quick Contact