The MAR ENAU TH 10 process is a new generation through hole system formulated to be used in the ENIG process.
The MAR ENAU TH 10 utilizes a blend of acids and surfactants which renders the palladium activated through-hole none active to further processing in an Electroless Nickel Immersion Gold process.
The MAR ENAU TH 10 system removes light oils, oxides and fingerprints on the copper surface leaving a very bright and active substrate for further processing.
The MAR ENAU TH 10 system has a very low surface tension characteristic allowing excellent wetting of all copper surfaces and through-hole. This allows easy rinsing of the boards.
The outstanding features of the MAR ENAU TH 10 process is:
OPTIMUM | RANGE | |
ENAU TH 10A | 10 % BV | 8 – 12 % BV |
ENAU TH 10B | 5 % BV | 4 – 6 % BV |
Temperature | 90 °F | 80 – 95 °F |
pH | < 1.0 | |
Time | 5 minutes | 3 – 5 minutes |
MAR ENAU TH 10A | 10 % BV |
MAR ENAU TH 10B | 5 % BV |
The pH must be maintained < 1.0 for maximum effectiveness.
Periodic addition of both ENAU TH 10A & ENAU TH 10B should be made after analysis of the ENAU TH 10A. Additions must be 2 parts ENAU TH 10A to 1 part ENAU TH 10B.
The solution should be dumped after processing 25 ssf of board per LITRE of made up solution MAR ENAU TH 10.
TANKS | Polypropylene, PVC, Polyethylene or fiberglass. |
HEATERS | PTFE, quarts, 316 SS of titanium. |
VENTILATION | Advises at 50 fpm. |
FILTRATION | Recommended filtration through a 25 micron polypropylene cartridge. |
AGITATION | Solution movement of 4 -5 solution turnovers per hour and rocker agitation of 6 inches per minute. |