PCB

MAR TH-10

The MAR ENAU TH 10 process is a new generation through hole system formulated to be used in the ENIG process.

The MAR ENAU TH 10 utilizes a blend of acids and surfactants which renders the palladium activated through-hole none active to further processing in an Electroless Nickel Immersion Gold process.

The MAR ENAU TH 10 system removes light oils, oxides and fingerprints on the copper surface leaving a very bright and active substrate for further processing.

The MAR ENAU TH 10 system has a very low surface tension characteristic allowing excellent wetting of all copper surfaces and through-hole. This allows easy rinsing of the boards.

The outstanding features of the MAR ENAU TH 10 process is:

  • Two part system
  • Superior rinse ability
  • Excellent wettability in high aspect ratio boards
  • Allows easy deposition of ENIG
OPERATING CONDITIONS
OPTIMUM RANGE
ENAU TH 10A 10 % BV 8 – 12 % BV
ENAU TH 10B 5 % BV 4 – 6 % BV
Temperature 90 °F 80 – 95 °F
pH < 1.0
Time 5 minutes 3 – 5 minutes
MAKE-UP
MAR ENAU TH 10A 10 % BV
MAR ENAU TH 10B 5 % BV
SOLUTION CONTROL

The pH must be maintained < 1.0 for maximum effectiveness.

Periodic addition of both ENAU TH 10A & ENAU TH 10B should be made after analysis of the ENAU TH 10A. Additions must be 2 parts ENAU TH 10A to 1 part ENAU TH 10B.

The solution should be dumped after processing 25 ssf of board per LITRE of made up solution MAR ENAU TH 10.

EQUIPMENT
TANKS Polypropylene, PVC, Polyethylene or fiberglass.
HEATERS PTFE, quarts, 316 SS of titanium.
VENTILATION Advises at 50 fpm.
FILTRATION Recommended filtration through a 25 micron polypropylene cartridge.
AGITATION Solution movement of 4 -5 solution turnovers per hour and rocker agitation of 6 inches per minute.
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