PCB
MAR PDS
ENAU PDS is a specially designed palladium system used to activate the copper surface on a PCB board prior to the deposition of electroless nickel plating process MAR ENEU 12.
ENAU PDS is a Sulphuric acid palladium system used to provide activation of copper with excellent adhesion characteristics.
Advantages of the ENAU PDS process include:
- Consistent deposition rate.
- Economical to operate with 2 – 5 metal turnovers.
- Single component system.
- Easy to control by simple analytical methods.
- Operative at room temperature.
- Contains no chloride.
SOLUTION MAINTENANCE
Bath Replenishment
To ensure proper operation of the ENAU PDS system, the solution chemistry must be maintained between 40 – 50 mg/litre of palladium. This is accomplished by measuring and monitoring the palladium concentration via a standard AA Spectroscopy.
The Sulphuric acid should be analyzed using the standard titration methods.
| Palladium | 10 ml/litre of ENAU PDS will increase Pd content by 10 mg/l |
| Normality | 10 ml/litre of Sulphuric acid s.g. 1.84 will increase the Normality content by 0.36 N |
PERFORMANCE
| Plating rate @ 190°F | 0.3 to 0.5 mils/hr |
| Solution life | 7 to 8 |
EQUIPMENT
| Tanks: | The installation can be made of Polypropylene, Polyethylene or hard PVC. |
| Heaters: | If required glass, porcelain, PTFE or quartz heater may be used. |
| Filtration | The solution should be regularly filtered, preferably continuously through 5 micron or smaller cartridges. (Cartridges must be leached for one hour in 10% Sulphuric acid and then rinsed well before use.) The recommended filtration rate is 1 - 2 solution turnovers per hour. |
| Agitation | No air agitation. Mechanical movement is highly recommended. |
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