PCB
Desmear
MAR SW-33
MAR SW-33 is a superior hole wall conditioner for circuit boards constructed of constructed of epoxy, polyamide and other materials. It facilitates rapid, uniform drill smear removal or etchback when used with MAR-Tech conditioning chemistry... View More
MAR MN-63
MAR MN-63 is designed to desmear and increase resin surface activity promoting reliable electroless copper interconnection, coverage and adhesion. It can be used on a variety of resin systems including polyimide... View More
MN-66
MN-66 is a post-etch back neutralizer solution designed to neutralize and clean permanganate residue from the holes of printed circuit boards. It insures a well-conditioned hole wall surface that allows for subsequent electroless copper coverage... View More
GE-70
GE-70 is an effective glass etch that may be used at low concentrations to frost glass fiber tips, or, at higher concentrations to completely remove glass fibers protruding into the hole... View More
Electroless Copper
MAR CC-18
MAR CC-18 conditions the hole-wall which during the activation step with a palladium tin catalyst complex will seed the epoxy and glass to form a minute seed which will assist in the final formation of a tight dense copper grain structure... View More
MAR E’CU 26
MAR E’CU 26 has a bright, dense, uniform, conductive copper plate with a low stress deposit and excellent hole-wall adhesion. The MAR E’CU 26 system is capable of a deposition rate in excess of 60 millionths of an inch in 30 minutes... View More
MAR PD-70C
MAR PD-70C crystal is dissolved in water and used as a pre-dip prior to the MAR CT-74 ACTIVATOR. This low acid solution prepares the substrate surface for uniform absorption of the palladium activator while minimizing copper attack of the inner layers of multi-layer panels... View More
MAR CT-74
MAR CT-74 provides a minute, highly charged colloid which promotes a uniform, highly adherent electroless copper deposit. CT-74 is a very stable chemistry with a low halogen content which minimizes copper attack and produces an absorbent palladium deposit... View More
MAR AC-77
MAR AC-77 Accelerator is a non-fluoride product. It enhances catalyst activity on glass and dielectric materials. It provides a void free and reliable electroless copper deposit... View More
MAR EC-92
MAR EC-92 View More
Film stripper
MAR FILM STRIP 46
MAR FILM STRIP 46 is an aqueous solution designed to strip aqueous dry film photo-resist and alkaline soluble screen printing inks. The MAR Film Strip 46 has a rapid strip rate for high speed horizontal applications... View More
Metal Stripper
MAR TIN STRIP 36
MAR TIN STRIP 36 is a clear, light yellow/green nitric acid based solution which is used for stripping tin or tin/lead resist from printed circuit boards... View More
MAR TIN STRIP TP
MAR TIN STRIP TP is a two part system which is used for stripping tin or tin/lead resist from printed circuit boards. MAR Tin Strip TP consists of TP Part A which removes the electroplate tin to the intermetallic layer... View More
Developer
DS-450 DEVELOPER
DS-450 DEVELOPER is a concentrated, highly stabilized liquid developer solution for developing both fully aqueous and semi-aqueous photopolymer resists and liquid photo imagable solder masks (LPI)... View More
Fluxes
Fluxes
MAR HTF 7101 flux is a unique blend of ingredients formulated for use in the hot air leveling process. The MAR HTF 7101 flux will remove light copper oxides and apply a protective layer of flux to protect solder mask and promote good solderability of copper pads... View More
ENIG
MAR TH-10
MAR TH-10 utilizes a blend of acids and surfactants which renders the palladium activated through-hole none active to further processing in an Electroless Nickel Immersion Gold process... View More
MAR ENDEP 12
MAR ENDEP 12 is an electroless nickel plating process formulated to deposit a semi-bright to bright, high phosphorus – nickel alloy exhibiting high intrinsic corrosion resistance... View More
MAR IMAU
MAR IMAU is designed for the deposition of a gold layer over a Nickel-Phosphorous substrate as a final finish for further processing... View More
MAR OPS
MAR OPS is supplied as a dry acid salt which can be dissolved in dilute Sulphuric acid at ambient temperature. The system provide a fume-free copper activator... View More
MAR PDS
MAR PDS is a specially designed palladium system used to activate the copper surface on a PCB board prior to the deposition of electroless nickel plating process MAR ENEU 12... View More