PCB

MAR ENDEP 12

ENAU 12 is an electroless nickel plating process formulated to deposit a semi-bright to bright, high phosphorus – nickel alloy exhibiting high intrinsic corrosion resistance.

ENAU 12 is an electroless nickel plating process formulated to deposit a semi-bright to bright, high phosphorus – nickel alloy exhibiting high intrinsic corrosion resistance.

ENAU 12 is supplied as a three-component liquid system. ENAU 12-A and ENAU 12-B are only used for bath make-up. The bath concentration is maintained with ENAU 12-A and ENAU 12-C.

Advantages of the ENAU 12 process include:

• Consistent deposition rate throughout the life of the bath.
• Unique stabilizer chemistry provides for long stable bath life.
• Economical to operate with 7 – 8 metal turnovers.
• Non-magnetic coating.
• Freedom from porosity resulting in excellent wear resistance and corrosion resistance.
• The applied deposit is compressively stressed.

DEPOSIT PROPERTIES

SOLUTION MAKEUP

ENAU 12-A 6.0 % by volume

ENAU 12-B 18 % by volume

Deionized water To operating volume

1. Fill tank to one-half its final volume with distilled or deionized water.
2. Add ENAU 12-B followed by the ENAU 12-A and mix well.
3. Add water to final volume, mix well and heat to 188 oF.
4. Analyze the nickel content and adjust to 6 g/l if necessary.
5. Adjust pH, as required, to be in operating range of 4.8 by carefully adding ammonium hydroxide to raise pH and 20% by volume Sulphuric acid to lower pH.

OPERATING PARAMETERS

pH can be adjusted up with a 50% solution of ammonium hydroxide or potassium carbonate solution. Sulfuric acid, 10% by volume can be used to lower pH.

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